Wholesale ZT31003 4.2mm Sealed Through-Hole Header

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  • ZT31003 4.2mm Sealed Through-Hole Header
  • ZT31003 4.2mm Sealed Through-Hole Header
  • Product Details
  • Parameter

Key Features

Vertical pins support through-hole PCB mounting.

Matched waterproof pads are available for each circuit layout.

6, 8, 12 and 16 circuit versions support several harness widths.

The 4.2mm pitch is consistent across the series.

The product is suited to board assemblies that require a sealed mounting interface.


Applications

Industrial PCB control systems. Sealed electrical interfaces.

Power and signal distribution boards. Multi-circuit wiring assemblies.


Ordering & Quotation Information

Please specify circuit count, PCB thickness, required pin length and waterproof-pad requirement. The selected pad should match the header circuit configuration.


FAQ

Q1: Which circuit counts are offered?
A: The header is available in 6, 8, 12 and 16 circuit configurations.

Q2: Is the header designed for SMT mounting?
A: No. It uses vertical through-hole pins for PCB mounting.

Q3: Does the waterproof pad need to match the header?
A: Yes. The waterproof pad should be selected according to the circuit configuration.

Q4: What PCB thickness is applicable?
A: The listed PCB thickness is 1.6mm.


Request a Quote

Provide your circuit count and board requirement to quote the ZT31003 4.2mm Sealed Through-Hole Header.

Company
Zhejiang Zhente Technology Co., Ltd.
Zhejiang Zhente Technology Co., Ltd.

Zhejiang Zhente Technology Co., Ltd. specializes in new energy components, with applications in energy storage batteries, new energy vehicles, cloud servers, aerospace, telecommunications and electrical fields.
As a national high-tech enterprise, we participated in drafting national standards for electric vehicle electrical safety, and hold provincial-level industrial design and technology research center status, as well as "Specialized, Refined, Differential, and Innovative" recognition. We operate independent mold design, automation equipment design, and experimental centers.

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